1. 2. 3. material content data sheet sales product name idh05sg60c issued 29. august 2013 ma# MA000629884 package pg-to220-2-1 weight* 1965.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.807 0.04 411 noble metal gold 7440-57-5 0.025 0.00 13 non noble metal tin 7440-31-5 0.007 0.00 0.04 3 427 leadframe non noble metal iron 7439-89-6 1.343 0.07 683 inorganic material phosphorus 7723-14-0 0.403 0.02 205 non noble metal copper 7440-50-8 1341.263 68.22 68.31 682244 683132 wire non noble metal aluminium 7429-90-5 0.162 0.01 0.01 82 82 encapsulation organic material carbon black 1333-86-4 9.109 0.46 4633 plastics epoxy resin - 100.198 5.10 50967 inorganic material silicondioxide 60676-86-0 497.954 25.33 30.89 253289 308889 leadfinish non noble metal tin 7440-31-5 14.487 0.74 0.74 7369 7369 plating non noble metal nickel 7440-02-0 0.198 0.01 101 inorganic material phosphorus 7723-14-0 0.000 0.00 0.01 0 101 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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